Method and Apparatus for Supplying Power to VLSI Silicon Chips

ABSTRACT

An integrated circuit module, system and method of providing power and signals is disclosed that includes a silicon chip and a package substrate having voltage connections and signal connections. The silicon chip includes a silicon substrate having a top surface, a bottom surface and circuitry formed therein, one or more front-side metal layers formed on the top surface of the silicon substrate, one or more back-side metal layers formed on the bottom surface of the silicon substrate, and one or more through silicon vias (TSVs) formed through the silicon substrate for creating a conductive pathway from the back-side of the silicon substrate to the front-side of the silicon substrate, preferably closest to the silicon substrate.

BACKGROUND

The present invention relates to integrated circuits, including VeryLarge Scale Integration (VLSI) silicon chip modules or packages, andmethods and architectures for supplying power to integrated circuitsincluding VLSI chip modules/packages.

With recent advancement of information technology and wide use of theInternet to store and process information, more and more demands areplaced on the acquisition, processing, storage, and dissemination ofinformation by information handling systems, e.g., computing systems.Information handling systems are being developed to increase the speedat which they are able to execute increasingly complex applications forbusiness, personal use, and entertainment. Overall system performance isaffected by each of the key elements of the information handling system,including the performance/structure of the integrated circuits or chips,processors, any memory devices or caches, input/output (I/O) subsystems,efficiency of the memory control functions, any associated memoryinterface elements, and the type and structure of the circuitinterconnect interfaces.

The constantly increasing speed of information handling systems whichexecute increasingly complex applications places more rigorousperformance demands on the multitude of integrated circuits or chipsforming the circuitry in such systems. One manner to handle theincreasing demands on such systems and circuitry has been thedevelopment of integrated circuits, and in particular Very Large ScaleIntegration (VLSI) silicon chip modules or packages. As VLSI increasessilicon chip performance, the number of connections to the VLSI chipmodule has increased such that a significant amount of metal routingresources are used to provide various signal connections to the VLSIchip as well as to provide power to the VLSI chip. Newer VSLI integratedcircuits and chips are limited by routing resources (routing of signalsand power).

Computing demands require the ability to access an increasing number ofhigher density devices at faster and faster access speeds. The densityof these VLSI chips and amount of power utilized by these VLSI chipstypically generates a large amount of heat that may require the use of aheat sink. Extensive research and development efforts are invested bythe industry to create improved and or innovative solutions to maximizeoverall chip performance by improving the design, structure, and/or themethods by which integrated circuits, including VLSI chips, and/ormodules are made and operate. As device scaling continues to facilitateincreases in the number of devices, e.g., transistors, per unit area onthe silicon chip, the requirements for routing signals and power need tobe addressed.

SUMMARY

The summary of the disclosure is given to aid understanding ofintegrated circuits, including VLSI silicon chips and/or modules andpackages containing integrated circuits, their architectural structure,and their method of operation and fabrication, and not with an intent tolimit the disclosure or the invention. The present disclosure isdirected to a person of ordinary skill in the art. It should beunderstood that various aspects and features of the disclosure mayadvantageously be used separately in some instances, or in combinationwith other aspects and features of the disclosure in other instances.Accordingly, variations and modifications may be made to the integratedcircuits, VLSI silicon chips, modules, packages, architecturalstructure, and/or method of operation and fabrication to achievedifferent effects.

In an embodiment, an integrated circuit module is disclosed thatincludes a silicon chip and a package substrate having voltageconnections and signal connections. The silicon chip includes a siliconsubstrate having a top surface, a bottom surface and circuitry formedtherein, one or more front-side metal layers formed on the top surfaceof the silicon substrate, one or more back-side metal layers formed onthe bottom surface of the silicon substrate, and one or more throughsilicon vias (TSVs) formed through the silicon substrate for creating aconductive pathway from the back-side of the silicon substrate to thefront-side of the silicon substrate. In an embodiment, the module isconfigured so that: a plurality of signal routing pathways are formedfrom the signal connections on the package substrate through a pluralityof C4 connections to one or more of the front-side metal layers to thecircuitry in the silicon substrate, and a plurality of voltage routingpathways are formed from the voltage connections on the packagesubstrate to the one or more back-side metal layers to the one or moreTSVs to one or more of the front-side metal layers to the circuitry inthe silicon substrate.

In an aspect, the one or more TSVs are configured to extend through thesilicon substrate to the front-side metal layer closest to the topsurface of the silicon substrate, and preferably the voltage routingpathways extend to the front-side metal layer closest to the top surfaceof the silicon substrate. In an embodiment, the voltage routing pathwaysare configured and routed from the voltage connections on the packagesubstrate through wire bonds to the one or more back-side metal layers.All voltage connections on the package substrate in an aspect areconfigured and routed from the package substrate to the back-side metallayers. In a further aspect, all the voltage connections on the packagesubstrate are configured and routed from the package substrate throughwire bonds to the one or more backside metal layers.

In another embodiment, a method of providing power and signals to anintegrated circuit is disclosed where the method includes providing oneor more signals to one or more front-side metal layers formed on a topsurface of a silicon substrate, providing one or more voltages to one ormore back-side metal layers formed on a bottom surface of a siliconsubstrate; and providing one or more voltages to the one or morefront-side metal layers from the one or more backside metal layersthrough the silicon substrate. In an aspect, all the signals areprovided to the one or more front side metal layers, preferably throughC4 connections. In an embodiment, all the voltages are supplied to theone or more back-side metal layers. In an embodiment, the voltages aresupplied from the backside metal layers to the front-side metal layerclosest to the silicon substrate, preferably through the siliconsubstrate to the one or more front-side metal layers using one or moreTSVs.

In a further embodiment, a method of forming an integrated circuitmodule is disclosed that includes forming circuitry in a siliconsubstrate, forming one or more front-side metal layers on a top surfaceof the silicon substrate including forming one or more front-sideconductive signal pathways to route signals to the circuitry, formingone or more back-side metal layers on a bottom surface of the siliconsubstrate including forming one or more back-side conductive powerpathways to route voltages to the back-side of the silicon substrate,forming one or more front-side conductive power pathways in the one ormore front-side metal layers to route power to the circuitry, andproviding one or more through silicon vias (TSVs) to route the one ormore backside conductive power pathways through the silicon substrate tothe one or more front-side conductive power pathways. In a preferredembodiment, at least one of the TSVs extends from the backside metallayers though the silicon substrate to only the top-side metal layerclosest to the silicon substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The various aspects, features, and embodiments of integrated circuits,VLSI silicon chips, VLSI chip module/packages, architectural structure,and their method of operation and fabrication will be better understoodwhen read in conjunction with the figures provided. Embodiments areprovided in the figures for the purpose of illustrating aspects,features, and/or various embodiments of the integrated circuit, VLSIchip, VLSI chip module/package, architectural structure, and method ofoperation and fabrication, but the claims should not be limited to theprecise arrangement, structures, features, aspects, embodiments,methods, or devices shown, and the arrangements, structures,subassemblies, features, aspects, embodiments, methods, and devicesshown may be used singularly or in combination with other arrangements,structures, subassemblies, features, aspects, embodiments, methodsand/or devices.

FIG. 1 depicts the cross-section of an embodiment of a VLSI silicon chipmodule.

FIG. 2 depicts metal layers or planes as may be utilized in a VLSI chip.

FIG. 3 depicts the cross-section of an embodiment of a VLSI chip moduleaccording to the disclosure.

FIG. 4 depicts the cross-section of another embodiment of a VSLI chipmodule according to the disclosure.

FIG. 5 depicts an embodiment of a method of configuring the signal andvoltage connection and routing pathways for a VLSI chip module.

FIG. 6 depicts an embodiment of a method of powering and providingsignal connections in a VLSI chip module.

DETAILED DESCRIPTION

The following description is made for illustrating the generalprinciples of the invention and is not meant to limit the inventiveconcepts claimed herein. In the following detailed description, numerousdetails are set forth in order to provide an understanding of integratedcircuits, VLSI chips, and modules (also referred to as packages), theirarchitectural structure, and their method of operation and fabrication,however, it will be understood by those skilled in the art thatdifferent and numerous embodiments of the integrated circuit, VLSI chip,VLSI chip module/package, architectural structure, and method ofoperation and fabrication may be practiced without those specificdetails, and the claims and invention should not be limited to theembodiments, subassemblies, structures, features, processes, methods,aspects, or details specifically described and shown herein. Further,particular features described herein can be used in combination withother described features in various possible combinations andpermutations.

Unless otherwise specifically defined herein, all terms are to be giventheir broadest possible interpretation including meanings implied fromthe specification as well as meanings understood by those skilled in theart and/or as defined in dictionaries, treatises, etc. It must also benoted that, as used in the specification and the appended claims, thesingular forms “a,” “an” and “the” include plural referents unlessotherwise specified.

One area where integrated circuits, and particularly VLSI chips and/ormodules, are used is in the many circuits and systems utilized incomputing or data processing systems. The computing systems may takemany forms and the VLSI chips or modules in an embodiment may includeone or more processors, Random Access Memory (RAM) modules, nonvolatilememory, devices, device specific circuits, I/O interfaces, and I/Odevices and peripherals.

Integrated circuits, including VLSI circuits, are fabricated on a thinsilicon wafer, also referred to as a silicon substrate. VLSI processtechnology fabricates circuits on one side of the silicon substrate orwafer. As shown in FIG. 1, which is a cross-section of a silicon chipmodule/package 100, the transistors, diodes, resistors, capacitors andother devices, e.g., the chip devices and circuitry 102, are formed inthe front or top side 104 of silicon substrate 105, and then thin metallayers or strips with insulating layers there between, referred to asmetal layers 110, are formed on the front or top side 104 of the siliconsubstrate 105. Power and signals are delivered or routed to thecircuitry (e.g., transistors, diodes, resistors, capacitors, etc.) insilicon substrate 105 through the stack of metal layers 110. Conductivevia structures 108 interconnect multiple metal layers 110 to formconductive routing paths for signals and power.

FIG. 2 is a top view of the top metal layers or planes 110. As shown inFIG. 2, in an embodiment, metal layer or plane 110 is formed as aplurality of parallel metal strips formed into two layers with aninsulator or dielectric (not shown) sandwiched between and isolating themetal layers and strips. More specifically, metal layers or planes in anembodiment include a plurality of vertically aligned alternatingparallel strips 262, 264 on top that are electrically isolated from eachother and a plurality of horizontally aligned alternating parallelstrips 266, 268 underneath the top plane that are electrically isolatedfrom each other and from the top layer of vertical strips 262, 265. Viastructures 108 connect strips 262 and 266 to form a first conductiverouting pathways, while via structures 108′ connect strips 264 and 265to form a second conductive routing pathway. Metal layers or strips 110are connected together using a series of via structures 108 to ensuregood connectivity and provide signal or power routing pathways to thesilicon substrate 105. These conductive routing pathways form signalrouting pathways that serve to route data signals, control signals andother signals to the circuitry in the silicon substrate. Differentconductive routing pathways form conductive power routing pathways toform a power grid to provide power to the circuitry 102 in the siliconsubstrate 105. While FIG. 2 shows only two conductive routing pathwaysbeing utilized, it can be appreciated that more and different conductivepathways can be utilized and applied to chip 120. In addition, more orless via structures may be utilized to connect the strips forming themetal-dielectric layers or planes 110.

VLSI chip module 100 has a package substrate 140 (also referred to as aconnector substrate) thorough which the signals and power are deliveredto the silicon chip 120. The power and signals are delivered to the chip120 from the package substrate 140 through an array of solder bumps orballs 130 that is sometimes referred to as a controlled collapse chipconnection (C4). In particular, the chip 120 is placed upside down andan array of solder balls or bumps 130 are placed on pads 125 on the chip120 to attach the chip 120 to respective pads 145 on the packagesubstrate 140 to provide the various power and signal connections to thesilicon chip 120.

For example, one or more different voltage levels, e.g., VDD 190 and VSS(ground) 195, are supplied to package pads 145. The power (voltage)connections 190, 195 are made from the package pads 145, through thesolder balls 130, to the pad 125 in the highest level metal-dielectricstrip/layer 110. The power then flows through various metal-dielectriclayers 110 and via structures 108, e.g. the voltage or power conductivepathway, to the circuitry (e.g., the transistors) fabricated in thesilicon substrate 105. In addition, a number of signal connections 172,174, 176, 178 are made from the package pads 145 in the packagesubstrate to the C4 connection bumps 130 to pads 125 on chip 120. Thevarious signals then are routed through the metal layers 110 by viastructures 108 to form signal conductive pathways to the circuitry. Thismethod and structure leaves the bottom surface 115 (the backside) of thesilicon substrate 105 completely unused and heat sinks 150 may attach(with thermal interface material (TIM) 160 in the middle) to that unusedback side 115 of the silicon substrate 105 to help with heat dissipationto form a chip module 100 as shown in FIG. 1.

Some of the problems associated with the typical VLSI silicon chipdesign include: (a) a significant amount of metal routing resourcesbeing allocated to form the power grid, (b) significant IR (voltage)drop and power loss through the power rails formed in the metal layersand the via structures, which may also slowdown the circuit, (c)allocating a large number of controlled collapse chip connection (C4)bumps to power connections, e.g., VDD/VSS, limits the number ofconnections that can be used for signal connections to the packagesubstrate, (d) variations in IR drop in different locations of the chipmakes it challenging to time convergence, and (e) multiple voltagedomains sharing limited C4 and wiring resources.

A new and improved method, structure, module, package, and/orarchitecture to supply power to integrated circuits, including VLSIsilicon chips, is disclosed. In another embodiment, a new and improvedmethod, structure, module, package, and/or architecture to providesignal connections to an integrated circuit, including VLSI siliconchips, is disclosed. In an embodiment, the new method, structure,module, package, and architecture supplies power using Through SiliconVias (TSVs) and package wire bonds. In an aspect, the method, structure,module, package, and architecture involves using metal back planes orlayers and supplying power to the silicon chip from the backside of thesilicon substrate using metal back planes. The method, structure,module, package, and architecture makes more C4 connections (bumps) andmore routing resources available for signal connections, enables use ofwider buses for memory and peripheral connections, which may permit thebuses to run slower and consume less power. The new method, structure,module, package, and architecture may permit smaller chip modules asmore routing resources are available for signal routing which will allowdenser placement of cells. The new method, structure, module, package,and architecture also permits power to be delivered closer to the actualsilicon devices, e.g. transistors, and may lower the IR (voltage) dropin supplying power to the circuitry in the silicon substrate. The newmethod, structure, module, package, and architecture also does notrequire major modifications in package/module and heatsink design.

FIG. 3 depicts a VLSI silicon chip module 300 having backside metallayers 360 and wire bonds 380 to supply power to the silicon chip. Asshown in FIG. 3, backside metal planes 360 are formed on the bottomsurface or backside 115 of the silicon substrate 105 in addition tometal layers 110 formed on the front surface or front side 104 of thesilicon substrate 105. The metal layers 110 on the front side 104 of thesilicon substrate 105 utilize via structures 108 to provide signalrouting pathways to receive and send signals to and from the packagesubstrate 340. In an embodiment, all the signal connections 370 to thesilicon chip 220 are from the front side 104 of the silicon substrate105. Signals 370, e.g., data and/or control signals, are sent andreceived through package substrate 340 to solder balls (C4 connections)330 to the chip 320, and more specifically to metal layers 110 throughvia structures 108 to portions of the chip 320 and the silicon substrate105.

Backside metal layers 360 are formed are provided on the bottom surfaceor backside 115 of the silicon substrate 105 and are used to form one ormore voltage planes on the backside of the silicon substrate. Forexample, alternating metal strips and interconnecting via structures asillustrated and described with reference to FIG. 2 can be formed orprovided on the backside of the silicon substrate 105 to form a powergrid 386 of one or more voltages on the backside of the siliconsubstrate. The backside metal layers and via structures form a power orvoltage routing pathway in the backside metal layers 360. One or morevoltage connections are supplied to the backside metal layers 360. Inthe example of FIG. 3, one or more wire bonds 380 are connected to oneof the back-side metal layers or strips 360 to form a VDD plane and oneor more wire bonds 380 are connected to different backside metal planeor strips 360 to form a VSS or ground plane. TSVs 365 extend from themetal-dielectric layers 260 through the silicon layer 105, and in someinstances to front-side metal layers 110.

In an embodiment, power or voltage pathways are also formed in thefront-side metal layers 110, preferably in the one or two front-sidemetal layers closest to the front or top surface 104 of the siliconsubstrate. The one or two front-side metal layers closest to the frontor top surface of the silicon substrate preferably form a power orvoltage grid 385 of two or more voltage levels, e.g., VDD and ground(VSS), and may utilize vias to interconnect various strips and metallayers. The power grid 385 supplies voltage (power) to the circuitry anddevices in the silicon substrate.

FIG. 4 depicts a cross-section of an embodiment of a VLSI chip modulehaving a package substrate 340 with C4 bumps 330 to deliver signals,e.g., data and/or control signals, to the front side 104 of the chip 320and/or silicon substrate 105, and specifically to metal layers/strips110. Conductive signal pathways in the front-side metal layers 110deliver signals to the circuitry and/or to other portions of the chip320. In an embodiment, all signal connections are delivered to the frontside metal layers from the package substrate and signal routing pathwaysare formed in only the front side metal layers.

In the embodiment of FIG. 4, wire bonds 382, 384 are used to supplypower, e.g., voltage, to the back-side metal layers/strips 360 formed onthe bottom surface 115 of the silicon substrate 105. The metal layerspreferably are provided with conductive power routing pathways todistribute the different voltages in the backside metal layers and toform a power/voltage grid 386. Via structures as illustrated in FIG. 2may be used to form the conductive power routing pathway and/or powergrid 386. TSVs 365 are used to tunnel through silicon substrate 105 andto supply a conductive routing pathway to the front side layers/strips110, and preferably to the one or more front-side metal layers/strips110′ closest to the front/top side 104 of the silicon substrate,preferably to the front side metal layer 110′ closest to the siliconsubstrate, to supply power (voltage) to the front-side layers 110. Apower (voltage) grid 385 may be formed in the front layers 110,preferably in an embodiment using via structures 108, to distributepower through the front layers 110. While two voltage levels have beendescribed in connection with the various embodiments it can beappreciated that more and different voltages may be supplied to thebackside metal layer using the structures and techniques described.

FIG. 4 shows a VLSI chip with power (voltage) supplied to backside metallayers of the VLSI chip. In an embodiment, there may be more front sidemetal layers 110 then back side metal layers 360, although designs mayhave less front side metal layers 110 than back side metal layers 360,or the same number of metal layers in the front-side and the back-side.In an embodiment, spacing is provided to create a wire bond contactpoint/pad with the one or more backside metal layers. In an embodiment,one or more notches 454, 456 may be formed in the heat sink 150 topermit wire bonds 382, 384 to connect to metal strip layers 320. In thedesign of FIGS. 3 and 4, there is more area for signal connection padson the front side of the silicon chip/module as power is supplied to theback side layers of the silicon chip/module.

An integrated circuit module is disclosed that in an embodimentincludes: a silicon chip having a silicon substrate having circuitryformed therein, the silicon substrate having a top surface and a bottomsurface; one or more front-side metal layers formed on the top surfaceof the silicon substrate; one or more back-side metal layers formed onthe bottom surface; and one or more through silicon vias (TSVs) formedthrough the silicon substrate for creating a conductive pathway from theback-side of the silicon substrate to the front-side of the siliconsubstrate. The integrated circuit module further includes a packagesubstrate having voltage connections and signal connections, where themodule is configured so that a plurality of signal routing pathways areformed from the signal connections on the package substrate through aplurality of C4 connections to one or more of the front-side metallayers to the circuitry in the silicon substrate, and a plurality ofvoltage routing pathways are formed from the voltage connections on thepackage substrate to the one or more back-side metal layers to the oneor more TSVs to one or more of the front-side metal layers to thecircuitry in the silicon substrate.

In the integrated circuit module, preferably one or more TSVs areconfigured to extend through the silicon substrate to the front-sidemetal layer closest to the top surface of the silicon substrate, and thevoltage routing pathways extend to the front-side metal layer closest tothe top surface of the silicon substrate. The voltage routing pathwaysin an embodiment are configured and routed from the voltage connectionson the package substrate through wire bonds to the one or more back-sidemetal layers. In an aspect, all voltage connections on the packagesubstrate are configured and routed from the package substrate to theback-side metal layers. In a further aspect, all the voltage connectionson the package substrate are configured and routed from the packagesubstrate through wire bonds to the one or more backsidemetal-dielectric strip layers.

In an embodiment, all the signal connections on the package substrateare configured and routed from the package substrate through C4connections to the one or more front-side metal layers. The integratedcircuit module may further include a heat sink attached to the siliconchip closer to the bottom surface of the silicon substrate than to thetop surface of the silicon substrate. Notches may be provided in theheat sink to facilitate connecting one or more wire bonds to the one ormore backside metal layers. The integrated circuit module in an aspectis configured to receive at least two voltage levels comprising VDD andground. The voltage levels in an embodiment are supplied to the one ormore backside metal layers and voltage power grid is provided in thetop-side metal layer closest to the silicon substrate.

FIG. 5 is an exemplary flowchart in accordance with one embodimentillustrating and describing a method of powering and providing signalsto an integrated circuit, including a method of powering an integratedcircuit, preferably a VSLI chip. While the method 500 is described forthe sake of convenience and not with an intent of limiting thedisclosure as comprising a series and/or a number of steps, it is to beunderstood that the process does not need to be performed as a series ofsteps and/or the steps do not need to be performed in the order shownand described with respect to FIG. 5, but the process may be integratedand/or one or more steps may be performed together, simultaneously, orthe steps may be performed in the order disclosed or in an alternateorder.

The method 500 of providing signal and power connections to a chipand/or chip module includes at 505 providing a silicon substrate withintegrated circuitry, e.g., transistors, diodes, resistors, capacitors,etc. Metal layers may be provided and/or formed at 510 on a front sideof the silicon substrate. That is, one or more metal layers may beformed on the top surface (e.g., front side) of the silicon substrate.In an aspect, the silicon substrate may be provided with integratedcircuitry formed in the silicon substrate and with metal layers providedon a front/top side of the silicon substrate. In an example, the metallayers may be formed as alternating strips electrically isolated fromeach other as described in connection with FIG. 2, although otherstructures and techniques for forming metal layers are contemplated. Inan embodiment, signal routing pathways, e.g., pathways for data andcontrol signals, are provided or formed in the front side metal layersat 520. In an aspect, one or more, and preferably a plurality of, viastructures may be formed in the front side metal layers to form incombination with the metal layers one or more signal pathways.

In an embodiment, additional metal layers at 525 are formed or providedon the backside of the silicon substrate. That is, in an embodiment oneor more metal layers may be formed on the bottom surface (e.g., backside) of the silicon substrate. In an aspect, one or more conductivepower (voltage) routing pathways at 530 are provided or formed in thebackside metal layers to create, in an embodiment, a power grid. In anexample, via structures may be utilized and the strip layer structureand techniques of FIG. 2 may be utilized to form the conductive power(voltage) routing pathways. Other structures and techniques arecontemplated for forming the conductive power (voltage) routing pathwaysin the backside metal layers. In an embodiment, an integrated circuit orsilicon chip is provided or created that includes in an aspect,circuitry in a silicon substrate, one or more metal layers formed orprovided on a front side of the silicon substrate for providing one ormore signal connections to the circuitry, and one or more metal layersprovided or formed on the backside of the silicon substrate forproviding voltage and/or power to the circuitry.

Through silicon vias (TSVs) are provided or formed at 535 through thesilicon substrate. In an embodiment, the TSVs are formed from thebackside metal layer closest to the silicon substrate through thesilicon substrate to the front side metal layer closet to the siliconsubstrate. The TSVs in embodiments, optionally extends to other frontside metal layers. The TSVs supply power from the backside of thesilicon substrate to the front side of the silicon substrate, and in anaspect creates a power grid in the front side metal layer closest to thesilicon substrate.

In an aspect, a chip is provided or formed having circuitry in a siliconsubstrate, top side metal layers forming signal pathways to thecircuitry, backside metal layers forming a power routing pathway to thebackside of the silicon substrate, and TSVs through the siliconsubstrate to provide power to one or more front side metal layers,preferably, to the front side metal layer closest to the siliconsubstrate to supply power to the front side of the silicon substrate,and preferably to form a power grid on the front side of the siliconsubstrate.

In an embodiment, at 540, C4 signal connections are provided between apackage substrate and the front side metal layers, where, in an aspect,the package substrate and C4 signal connections are configured andadapted for signal, e.g., data and control signals, and are notconfigured for power connections. In an embodiment, all signalconnections from the package substrate are supplied to the front sidemetal layers, in an aspect using only C4 bump connections. At 550, thepackage substrate is configured and adapted to provide power connectionsto the chips via wire bonding, and in an aspect, wire bonding forvoltage connections connect power connections on the package substrateto backside metal layers. In an embodiment, wire bondings connect powerconnections, e.g., one or more voltage levels, from the packagesubstrate to the backside strip layers.

FIG. 6 provides a flow chart of a method 600 of providing signalconnections and power voltage connections to a silicon chip and in anaspect, of providing power and signals to a chip. Flow chart 600 canalso be considered a method of forming or creating an integrated circuitor chip module. At 610, in an embodiment, one or more signalconnections, and in an aspect, preferably all signal connections, and ina further aspect, none of the power connections, are supplied and/orprovided to one or more metal layers on a silicon substrate, preferablyto one or more front side metal layers. In a further embodiment, at 610,the signal connections, preferably all of the signal connections aresupplied and/or provided to the front side metal layers from a packagesubstrate by C4 bump connections.

In a further aspect, at 620, one or more voltages, e.g., power, issupplied or provided to one or more backside metal layers on a siliconsubstrate. In an aspect, voltages may include one or more voltagelevels, including for example VDD, VSS (ground) or other voltage levels.In a further aspect, at 620, all the different voltage levels, e.g.,power, is supplied or provided from the package substrate to the backside metal layers of the chip. In a preferably aspect, the power and/orvoltages, and in an aspect all the voltage domains, are supplied orprovided to the backside metal from the package substrate by wire bonds.In an aspect, a power grid is formed by and in the backside metallayers.

In an embodiment, at 630, one or more voltages, e.g., power, aresupplied or provided from the backside metal layers and/or power grid toone or more front-side metal layers, and in an aspect to only thefront-side metal layers closest to the silicon substrate, and preferablyto the front-side metal layer closest to the silicon substrate. In anaspect, at 630, one or more voltages are supplied or provided from thebackside metal layers to the front-side metal layers through the siliconsubstrate, preferably using one or more TSVs. In an embodiment, power(e.g., one or more voltages, are supplied or provided from the backsidemetal layers to one or more of the front-side metal layers closest tothe silicon substrate, preferably the front-side metal layer closest tothe silicon substrate, preferably using one or more TSVs.

A method of providing power and signals to an integrated circuit isdisclosed where the method includes providing one or more signals to oneor more front-side metal layers formed on a top surface of a siliconsubstrate, providing one or more voltages to one or more back-side metallayers formed on a bottom surface of a silicon substrate, and providingone or more voltages to the one or more front-side metal layers from theone or more backside metal layers through the silicon substrate. In anembodiment, all the signals are provided to the one or more front sidemetal layers, and in an aspect all the signals are provided to the oneor more front-side metal layers through C4 connections. In a furtheraspect of the method, all voltages are supplied to the one or moreback-side metal layers, and in an embodiment are thereafter routed tothe front-side metal layer closest to the silicon substrate. Thevoltages in an embodiment are supplied to the one or more backside metallayers using wire bonds and the voltages are supplied from the back-sidemetal layers through the silicon substrate to the one or more front-sidemetal layers using one or more TSVs.

In a further aspect of the disclosure, a method of forming an integratedcircuit module is described that includes forming circuitry in a siliconsubstrate, forming one or more front-side metal layers on a top surfaceof the silicon substrate including forming one or more front-sideconductive signal pathways to route signals to the circuitry, formingone or more back-side metal layers on a bottom surface of the siliconsubstrate including forming one or more back-side conductive powerpathways to route voltages to the back-side of the silicon substrate,forming one or more front-side conductive power pathways in the one ormore front-side metal layers to route power to the circuitry, andproviding one or more through silicon vias (TSVs) to route the one ormore backside conductive power pathways through the silicon substrate tothe one or more front-side conductive power pathways. In an aspect, atleast one of the TSVs extends from the backside metal layers though thesilicon substrate to only the top-side metal layer closest to thesilicon substrate. In an embodiment, all the one or more back-sideconductive power pathways are wire bonded to a package substrate, and C4connections are formed between the package substrate and one or more ofthe front-side conductive signal pathways. In a further aspect, all theconductive signal pathways are formed in the front-side metal striplayers and no conductive signal pathways are formed in the back-sidemetal layers, and voltage planes are formed in the one or more top-sidemetal layers closest to the silicon substrate.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, and apparatus(systems). It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycirculating, semiconductor processing, structures and/or techniques. Theflowchart and block diagrams in the figures illustrate the architecture,functionality, and operation of possible implementations of systems, andmethods, according to various embodiments of the present invention. Inthis regard, each block in the flowchart or block diagrams may representa module, segment, circulating, or portions of integrated circuits,silicon chips and semi-conductors instructions for implementing thespecified function(s). In some alternative implementations, thefunctions noted in the block may occur out of the order noted in thefigures. For example, two blocks shown in succession may be executedsubstantially concurrently, or the blocks may sometimes be executed inthe reverse order, depending upon the functionality involved. It willalso be noted that each block of the block diagrams and/or flowchartillustration, and combinations of blocks in the block diagrams and/orflowchart illustration, can be implemented by other structures thatperform the specified functions or acts. It will be clear that thevarious features of the foregoing systems and/or methodologies may becombined in any way, creating a plurality of combinations from thedescriptions presented above.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed is:
 1. An integrated circuit module comprising: asilicon chip comprising. a silicon substrate having circuitry formedtherein, the silicon substrate having a top surface and a bottomsurface; one or more front-side metal layers formed on the top surfaceof the silicon substrate; one or more back-side metal layers formed onthe bottom surface; one or more through silicon vias (TSVs) formedthrough the silicon substrate for creating a conductive pathway from theback-side of the silicon substrate to the front-side of the siliconsubstrate; and a package substrate having voltage connections and signalconnections, wherein, the module is configured so that: a plurality ofsignal routing pathways are formed from the signal connections on thepackage substrate through a plurality of C4 connections to one or moreof the front-side metal layers to the circuitry in the siliconsubstrate, and a plurality of voltage routing pathways are formed fromthe voltage connections on the package substrate to the one or moreback-side metal layers to the one or more TSVs to one or more of thefront-side metal layers to the circuitry in the silicon substrate. 2.The integrated circuit module of claim 1, wherein the one or more TSVsare configured to extend through the silicon substrate to the front-sidemetal layer closest to the top surface of the silicon substrate, and thevoltage routing pathways extend to the front-side metal layer closest tothe top surface of the silicon substrate.
 3. The integrated circuitmodule of claim 1, wherein the voltage routing pathways are configuredand routed from the voltage connections on the package substrate throughwire bonds to the one or more back-side metal layers.
 4. The integratedcircuit module of claim 1, wherein all voltage connections on thepackage substrate are configured and routed from the package substrateto the back-side metal layers.
 5. The integrated circuit of claim 4,wherein all the voltage connections on the package substrate areconfigured and routed from the package substrate through wire bonds tothe one or more backside metal layers.
 6. The integrated circuit moduleof claim 4, wherein all the signal connections on the package substrateare configured and routed from the package substrate through C4connections to the one or more front-side metal layers.
 7. Theintegrated circuit module of claim 1, further comprising a heat sinkattached to the silicon chip closer to the bottom surface of the siliconsubstrate than to the top surface of the silicon substrate.
 8. Theintegrated circuit module of claim 7, further comprising notches in theheat sink to facilitate connecting one or more wire bonds to the one ormore backside metal layers.
 9. The integrated circuit module of claim 1,wherein the module is configured to receive at least two voltage levelscomprising VDD and ground.
 10. The integrated circuit module of claim 1,wherein the voltage levels are supplied to the one or more backsidemetal layers and voltage power grid is provided in the top-side metallayer closest to the silicon substrate.
 11. A method of providing powerand signals to an integrated circuit, the method comprising: providingone or more signals to one or more front-side metal layers formed on atop surface of a silicon substrate; providing one or more voltages toone or more back-side metal layers formed on a bottom surface of asilicon substrate; and providing one or more voltages to the one or morefront-side metal layers from the one or more backside metal layersthrough the silicon substrate.
 12. The method of claim 11, wherein allthe signals are provided to the one or more front side metal layers. 13.The method of claim 12, wherein all the signals are provided to the oneor more front-side metal layers through C4 connections.
 14. The methodof claim 11, wherein all the voltages are supplied to the one or moreback-side metal layers.
 15. The method of claim 11, wherein the voltagesare supplied to the front-side metal layer closest to the siliconsubstrate.
 16. The method of claim 11, wherein the voltages are suppliedto the one or more backside metal layers using wire bonds and thevoltages are supplied from the back-side metal layers through thesilicon substrate to the one or more front-side metal layers using oneor more TSVs.
 17. A method of forming an integrated circuit modulecomprising: forming circuitry in a silicon substrate; forming one ormore front-side metal layers on a top surface of the silicon substrateincluding forming one or more front-side conductive signal pathways toroute signals to the circuitry; forming one or more back-side metallayers on a bottom surface of the silicon substrate including formingone or more back-side conductive power pathways to route voltages to theback-side of the silicon substrate; forming one or more front-sideconductive power pathways in the one or more front-side metal layers toroute power to the circuitry; and providing one or more through siliconvias (TSVs) to route the one or more backside conductive power pathwaysthrough the silicon substrate to the one or more front-side conductivepower pathways.
 18. The method of claim 17, wherein at least one of theTSVs extends from the backside metal layers though the silicon substrateto only the top-side metal layer closest to the silicon substrate. 19.The method of claim 17, further comprising wire bonding all the one ormore back-side conductive power pathways to a package substrate; andforming C4 connections between the package substrate and one or more ofthe front-side conductive signal pathways.
 20. The method of claim 19,comprising forming all the conductive signal pathways in the front-sidemetal strip layers and no conductive signal pathways in the back-sidemetal layers, and forming voltage planes in the one or more top-sidemetal layers closest to the silicon substrate.